Global Die Attach Materials Market by Manufacturers, Regions, Type and Application, Forecast to 2025 By Innovation Market Research, Inc

 Pulichser: XYZResearch

May 2020

 Pages: 114

 IMR 7165

Global Die Attach Materials Market will reach 91.96 Million USD by the end of 2022 with a CAGR of 4.64%. The global Die Attach Materials market is valued at 73.30 Million USD in 2017 and will reach 91.96 Million USD by the end of 2022, growing at a CAGR of 4.64% during 2017-2022. Die-attach are the term reserved for processes where the face of a die is attached to a substrate by a single joint.

Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation of intermetallic compounds, which build an adhesion layer between substrate or die metallization and bulk solder. To achieve the best wetting and lowest void rate, the solder material should contain the lowest possible oxide content.

Die Attach Materials can be divided into three categories: die attach paste, die attach wire and others. Die attach paste accounted for the highest proportion in the production market, with a figure of 82.59% in 2017, followed by die attach wire, account for 13.63% and others account for 3.78%.

The consumption market share of global Die Attach Materials in consumer electronics, automotive, medical, telecommunications and others has been stable year by year, at 43.47%, 11.83%, 9.64%, 28.07% and 6.99% respectively in 2017, and for several consecutive years, the amplitude was within one percent. This indicates that the segment of the Die Attach Materials in the global market tends to be fixed without great changes. Among them, the Die Attach Materials market has the most promising sales prospects in telecommunications application.

Innovation Market Research center data shows China is the biggest contributor to the Die Attach Materials revenue market, accounted for 44.25% of the total global market with a revenue of 340.92 million USD in 2017, followed by Europe, 17.18% with a revenue of 132.38 million USD.

SMIC is the largest company in the global Die Attach Materials market, accounted for 7.60% of the revenue market share in 2017, followed by Henkel and Indium, accounted for 7.13% and 5.65% of the revenue market share in 2017.

Geographically, this report is segmented into several key Regions, with production, consumption, revenue (M USD), market share and growth rate of Die Attach Materials in these regions, from 2014 to 2026 (forecast), covering
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
South America (Brazil, Argentina, Columbia)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Global Die Attach Materials market competition by top manufacturers, with production, price, revenue (value) and market share for each manufacturer; the top players including
SMIC
Henkel
Shenzhen Vital New Material
Indium
Alpha Assembly Solutions
TONGFANG TECH
Umicore
Heraeu
AIM
TAMURARADIO
Kyocera
Shanghai Jinji
Palomar Technologies
Nordson EFD
Dow Corning Corporation

On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into
Die Attach Paste
Die Attach Wire
Others

On the basis on the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate of Die Attach Materials for each application, including
Consumer Electronics
Automotive
Medical
Telecommunications
Others

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